Grooving types

Submikron: Products » Lapping plates » Grooving types

Ungrooved

  • Application: small pieces, polishing pad carrier plate
  • Advantage: less scratch grade, less consumption of lapping media

Radial groove

  • groove depth max. 40 mm
  • Application: Standard products
  • Advantage: cost-efficient, higher stock removal than ungrooved plates, better flatness

Waffle groove

  • groove depth max. 40 mm
  • Application: Double sided lapping machines, high flatness requirements, difficult processable materials
  • Advantage: cost-efficient, higher stock removal than ungrooved plates, better flatness

Spiral groove

  • groove depth max. twice groove width
  • Application: high flatness requirements, difficult processable materials
  • Advantage: higher stock removal and better flatness than radial groove

Lapping plates

Fine grinding wheels

Composite poli-lapping plates
Bi-Composite poli-lapping plates
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