Submikron: Products » Polishing pads » W-Series

Woven W-Series

The allrounder among the polishing pads are the woven ones. Characteristically for this pad is its woven structure consisting of synthetic silk or fibre. The pad offers medium stock removal and has a medium life time. Altogether this group has a very good price-performance ratio. The woven pads are very suitable for the treatment of metallic workpieces and are generally used with diamond liquids.

The polishing result is not just influenced by the visible pad surface, but also by several carrier and PSA layers.

WH3

ABRASIVES

  • Diamantflüssigkeit 1-6 μm

CHARACTERISTICS

  • 100% wool
  • achieves very good flatness and surface
  • thickness: 0,33 mm
  • hardness: 87° Shore-A
  • weight: 310 g/cm³

WL15

ABRASIVES

  • diamond liquid 6-25 μ

CHARACTERISTICS

  • hard
  • taffeta material
  • semi manufacturing of TA6V, tantalum, zirconium and soft materials
  • easy bonding and removing due to a stiff carrier
  • thickness 0,77 mm

WK1

ABRASIVES

  • diamond liquid 1-6 μ

CHARACTERISTICS

  • medium-hard artificial silk
  • good stock removal rates
  • excellent finishing on almost all materials
  • thickness: 0,68 mm ±0,05
  • hardness: 90 Shore-A
  • weight 781 g/m²

WL10

ABRASIVES

  • diamond liquid 2-30 µ

CHARACTERISTICS

  • medium-hard
  • satined material
  • fine processing of stiff materials
  • easy bonding and removing due to a stiff carrier
  • thickness: 0,82 mm

WL50

ABRASIVES

  • diamond liquid 1-6 μ (Oil-/waterbased)

CHARACTERISTICS

  • soft
  • satined material
  • impregnated, smooth
  • strong adhesive effect
  • good resistance to shearing
  • applicable on double side polishing machines
  • thickness: 0,80 mm

WL950

ABRASIVES

  • diamond liquid 1-6 μ

CHARACTERISTICS

  • soft
  • satined material
  • impregnated, smooth
  • recommended for production
  • machine with Ø 380-1200 mm
  • thickness: 0,44 mm

Polishing pads

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