Submikron: Products » Lapping plates » Bi-Composite poli-lapping plates

Submikron: Products » Lapping plates » Bi-Composite poli-lapping plates

Bi-composite poli-lapping plates consist of two materials bounded in a resin bond, which are mounted on a plate, at which one component is implemented in a spiral, comb or punctual shape. Water- and oil-soluble diamond liquids are used as a lapping medium on this plates, at which monocrystalline diamond grits offer the best results. Depending on the type of the diamond grit either a higher degree of stock removal or less roughness and scratch tendency can be achieved. For the dosing of diamond liquid several dosing systems are available.

Contrary to conventional proceedings, the lapping and polishing plates are divided into several degrees of hardness. The spread diamond grit is subject to continuous speed changes while crossing variably hard polishing plate segments. Because of less plate hardness, in relation to the abrasive and to the to be processed workpiece, the diamond grit partially presses itself into the soft areas of the plate and induces directed tool marks. On the hard areas of the plate the grit rolls up with higher speed, that results in an additional polishing effect.

The essential advantage of the bi-composite-system is the surface processing in a single work step with a high degree of stock removal and the achievement of shiny surfaces at the same time. This enables lapping and polishing at the same time. Using this system is thus a supremely economic process, to reduce the time used for lapping and polishing, or rather reduce the processing steps.

The conditioning can be done in a short time by the use of a diamond conditioning tool.

In production operation cooling of the lapping plate is recommended, in order to conduct generated heat and thus achieve reproducible results.

  • possible grooving: ungrooved, radial groove, spiral groove

BC-70

  • iron/steel resin bond
  • very hard (86/87 Shore D)
  • all-purpose
  • recommended grinding medium 1 μ - 45 μ
  • punctual structure

BC-80

  • iron/steel resin bond
  • very hard (86/87 Shore D)
  • all-purpose
  • recommended grinding medium 1 μ - 45 μ
  • punctual structure

BC-91

  • copper/tin resin bond
  • medium hard (84/85 Shore D)
  • for fine processing
  • recommended grinding medium 3 μ - 15 μ
  • comp structure

BC-92

  • tin/zinc resin bond
  • soft (82/83 Shore D)
  • for finishing
  • recommended grinding medium 1 μ - 6 μ
  • comp structure

Lapping plates

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